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TCGS0101GWP

This SiP module is a Ku-band, 1W output power, wafer-level packaged, 4-channel transmit/receive phased-array SiP. It integrates power amplifiers, low-noise amplifiers (LNAs), switches, amplitude-phase modulation circuits, temperature sensing, and other unit circuits to support time-division transmit/receive operation.

X-TA88

The standardized subarray is designed based on multi-channel silicon-based chips integrated with microwave multi-layer PCB boards. It incorporates 16 transmit/receive (T/R) channels and supports RF signal transmission/reception, beam scanning, and operating status reporting.

Ku-Band 16-Channel Standardized Subarray

The standardized subarray is based on an integrated design of multi-channel silicon-based chips and microwave multi-layer PCB. It comprises 16 transmit/receive channels and is capable of RF signal transmission and reception, beam scanning, operating status feedback, and built-in channel self-test.

Ku-Band 16-Channel Standardized Subarray

The standardized subarray is based on an integrated design of multi-channel silicon-based chips and microwave multi-layer PCB. It comprises 16 transmit/receive channels and is capable of RF signal transmission and reception, beam scanning, operating status feedback, and built-in channel self-test.